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Laser Process Machines for Display & Semiconductor
Laser micro-machine for 2D wide area surface
Laser micro-machining for 2D wide area surface
Specifications
Working area
350 x 350 mm
2
Positional Accuracy
5 um
Synchronization error
5 us
Maximum processing speed
400 mm/s
process error
10 um
ITO patterning
Micro hole drilling
PI film routing
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